Vurgulamak:
TIF700UU Computer CPU GPU Cooling Gap Pads High Performance 10.0W Thermal GAP PAD Materials For Al Servers
TIF®700UU Computer CPU GPU Cooling Gap Pads High Performance 10.0W Thermal GAP PAD Materials For Al Servers
The TIF®700UU Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies,such as large_tolerances,uneven surfaces,and the susceptibility of delicate components to mechanical damage.
Features:
> Good thermal conductivity: 10.0W/mK
> Good softness and fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
Applications
> Home appliance industry
> Power module
> Wearable device
> Solar photovoltaic panel
> LED lighting fixtures
> New energy vehicle power systems
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations
| Typical Properties of TIF®700UU Series |
| Property |
Value |
Test method |
| Color |
Gray |
Visual |
| Construction & Compostion |
Ceramic filled silicone elastomer |
****** |
| Density(g/cm³) |
3.3 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.030
(0.75)
|
0.040~0.200 (1.0~5.00) |
ASTM D374 |
| Hardness |
30/10 Shore 00 |
30/10 Shore 00 |
ASTM 2240 |
| Recommended Operating Temperature |
-40 to 200℃ |
*** |
| Breakdown Voltage(V/mm) |
≥4000 |
ASTM D149 |
| Dielectric Constant |
7.0 MHz |
ASTM D150 |
| Volume Resistivity |
＞1.0X1012 Ohm-meter |
ASTM D257 |
| Flame rating |
V-0 |
UL 94 (E331100) |
| Thermal conductivity |
10.0W/m-K |
ASTM D5470 |
| 10.0 W/m-K |
ISO22007 |
Product Specifications
Standard Thickness: 0.030"(0.75 mm)-0.200" (5.00 mm) with increments of 0.010 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
Mesajınız 20-3.000 karakter arasında olmalıdır!
