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TIF100-20-19S Soft Thermal Pad Electrically Insulating Pad With Exceptional Thermal Conductivity For AI Processors AI Servers
TIF100-20-19S Soft Thermal Pad Electrically Insulating Pad With Exceptional Thermal Conductivity For AI Processors AI Servers
Product descriptions
The TIF®100-20-19S Series is a well-balanced, general-purpose thermal pad.It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.
Features
> Good thermal conductive:2.0W/mK
> Good softness and fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
Applications
> Al Servers
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations
> Home appliance industry
> Power module
> Wearable device
> Solar photovoltaic panel
> LED lighting fixtures
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
| Typical Properties of TIF®100-20-19S Series |
| Property |
Value |
Test method |
| Color |
Yellow |
Visual |
| Construction & Compostion |
Ceramic filled silicone elastomer |
****** |
| Density(g/cm³) |
2.5 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.010~0.030 |
0.030~0.200 |
ASTM D374 |
| (0.25~0.50) |
(0.75~5.00) |
| Hardness |
65 Shore 00 |
45 Shore 00
|
ASTM 2240 |
| Continuos Use Temp |
-40 to 200℃ |
****** |
| Breakdown Voltage(V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant |
5.0 MHz |
ASTM D150 |
| Volume Resistivity |
＞1.0X1012 Ohm-meter |
ASTM D257 |
| Thermal conductivity(w/m-K) |
2.0 |
ASTM D5470 |
| 2.0 |
ISO22007 |
| Fire rating |
V-0 |
UL94 (E331100) |
Standard Sheets Sizes:
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm×406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
TheTIF®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in Vietnam.
Q:How can we get detailed price list?
A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.
Q: What kind of packaging you offer?
A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.
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