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Evde > Ürünler > Termal Ped > TIF100-30-06UF 1.5W/M.K Cooling Gap Filler Insulation Silicone Rubber High Conductive Thermal Pad For Semiconductor Heat Dissipation

TIF100-30-06UF 1.5W/M.K Cooling Gap Filler Insulation Silicone Rubber High Conductive Thermal Pad For Semiconductor Heat Dissipation

Ürün Ayrıntıları

Menşe yeri: Vietnam

Marka adı: Ziitek

Sertifika: RoHS

Model numarası: TIF100-30-06UF

Ödeme ve Nakliye Şartları

Min sipariş miktarı: 1000 pcs

Fiyat: 0.1-10 USD/PCS

Ambalaj bilgileri: 24*13*12cm karton

Teslim süresi: 3-5 iş günü

Ödeme koşulları: T/T

Yetenek temini: 100000 pc/gün

En İyi Fiyatı Alın
Vurgulamak:
Ürünler Adı:
1.5W/MK Soğutma Boşluğu Dolgu Yalıtım Silikon Kauçuk Yarı İletken Isı Dağıtımı için Yüksek İletken T
Malzeme:
Seramik Dolu Silikon Elastomer
Renk:
Beyaz
Sertlik:
75±5 kıyı 00
Örnek:
Örneksiz
Anahtar Kelimeler:
Termal ped
Termal iletkenlik:
3.0w/mk
Özgül ağırlık:
3.0g/cc
Alev derecesi:
94-V0
Başvuru:
CPU GPU Yarı İletken Yarı İletken
Ürünler Adı:
1.5W/MK Soğutma Boşluğu Dolgu Yalıtım Silikon Kauçuk Yarı İletken Isı Dağıtımı için Yüksek İletken T
Malzeme:
Seramik Dolu Silikon Elastomer
Renk:
Beyaz
Sertlik:
75±5 kıyı 00
Örnek:
Örneksiz
Anahtar Kelimeler:
Termal ped
Termal iletkenlik:
3.0w/mk
Özgül ağırlık:
3.0g/cc
Alev derecesi:
94-V0
Başvuru:
CPU GPU Yarı İletken Yarı İletken
TIF100-30-06UF 1.5W/M.K Cooling Gap Filler Insulation Silicone Rubber High Conductive Thermal Pad For Semiconductor Heat Dissipation

TIF100-30-06UF 1.5W/M.K Cooling Gap Filler Insulation Silicone Rubber High Conductive Thermal Pad For Semiconductor Heat Dissipation

 

Product descriptions

 

Ziitek TlF®100-30-06UF thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0.

 

Features

> Good thermal conductive 1.5W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized

 

Application

> Mainboard/mother board
> Notebook
> Power supply
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics

> Set top boxes
> Audio and video components
> LED floor light
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)

 

Typical Properties of TIF®100-30-06UF Series
Property Value Test method
Color White *****
Construction &Compostion Ceramic filled silicone elastomer *****
Specific Gravity 3.0g/cc ASTM D297
Thickness range 0.010"~0.20"(0.25mm~5.0mm) ASTM D374
Hardness 75±5 Shore 00 ASTM 2240
Continuos Use Temp -40 to 160℃ *****
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 5.0 MHz ASTM D150
Volume Resistivity 2.3X1013Ohm-meter ASTM D257
Flame rating 94 V0 UL E331100
Thermal conductivity 3.0W/m-K ASTM D5470

 

Standard Thicknesses

0.010-inch to 0.20 inch (0.25mm to 5.0mm)

 

Product Sizes:

8" x 16"(203mm x406mm)

Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming

 

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.

Request adhesive on double side with "A2" suffix.

 

Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.

TIF100-30-06UF 1.5W/M.K Cooling Gap Filler Insulation Silicone Rubber High Conductive Thermal Pad For Semiconductor Heat Dissipation 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

TIF100-30-06UF 1.5W/M.K Cooling Gap Filler Insulation Silicone Rubber High Conductive Thermal Pad For Semiconductor Heat Dissipation 1

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