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TIF00N-15-16E Silicone thermal gap pad for Graphics Card Thermal Module
TIF00N-15-16E Silicone thermal gap pad for Graphics Card Thermal Module
Product descriptions
TIF®100N-15-16E Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB,which effecitly enhances the efficiency and life-time of the heat generating electronic components.
Features
> Good thermal conductivity 1.5W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
Applications
> Cooling components to the
> chassis of frame
> Set Top Box
> Car Battery & Power Supply
> Charging Pile
> LED TVi Lighting
> Graphics Card Thermal Module
| Typical Properties of TIF®100N-15-16E Series |
| Property |
Value |
Test method |
| Color |
Blue |
Visual |
| Construction & Compostion |
Ceramic filled silicone elastomer |
****** |
| Density(g/cm³) |
1.3 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.010"~0.020" |
ASTM D374 |
| 0.25~0.50mm |
| Hardness |
35 Shore 00 |
ASTM 2240 |
| Recommended Operating Temperature |
-40 to 200℃ |
****** |
| Breakdown Voltage(V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant |
2.8 MHz |
ASTM D150 |
| Volume Resistivity |
＞2.0X1012Ohm-meter |
ASTM D257 |
| Flame rating |
V-0 |
UL 94 (E331100) |
| Thermal conductivity |
1.5 W/m-K |
ASTM D5470 |
| 1.5 W/m-K |
ISO22007 |
Product Specifications
Standard Thickness:0.020" (0.5 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25mm)
Standard Size:16"X16" (406 mmX406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
All products are compliant with UL94 V-0, SGS and ROHS standards.
Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL
Independent R&D team
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